Manufacturing method of metal structure of flexible multi-layer substrate
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United States of America Patent
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Jul 19, 2016
Grant Date -
Oct 25, 2012
app pub date -
Jul 4, 2012
filing date -
Oct 16, 2009
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Abstract
A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.
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