Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate

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United States of America Patent

PATENT NO 9397381
APP PUB NO 20130328646A1
SERIAL NO

13983796

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Abstract

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This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL COMPANY LTDCHIYODA-KU TOKYO 100-6606

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondou, Yuusuke Chikusei, JP 16 73
Mizuno, Yasuyuki Chikusei, JP 26 258
Mizushima, Etsuo Chikusei, JP 9 64
Watanabe, Yasushi Chikusei, JP 204 2847

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