LED packages and manufacturing method thereof
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United States of America Patent
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Jul 19, 2016
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N/A
app pub date -
Mar 11, 2014
filing date -
Mar 22, 2013
priority date (Note) -
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Abstract
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.
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