Systems, structures and materials for electronic device cooling
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United States of America Patent
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Jul 12, 2016
Grant Date -
Feb 13, 2014
app pub date -
Oct 16, 2013
filing date -
Jul 27, 2012
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Abstract
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.
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