Metal smart card with dual interface capability
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United States of America Patent
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Jul 12, 2016
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N/A
app pub date -
Jul 8, 2015
filing date -
Jul 8, 2015
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Abstract
A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
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