Air-flow-by cooling technology and air-flow-by circuit board modules
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United States of America Patent
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Jul 12, 2016
Grant Date -
Jun 12, 2014
app pub date -
Dec 3, 2013
filing date -
Dec 3, 2012
priority date (Note) -
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Abstract
Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.
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