Device using glass substrate anodic bonding
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United States of America Patent
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Jul 12, 2016
Grant Date -
Jul 2, 2015
app pub date -
Jan 19, 2014
filing date -
Dec 27, 2013
priority date (Note) -
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Abstract
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
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