Method of manufacturing printed circuit board
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United States of America Patent
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Jul 5, 2016
Grant Date -
Jan 22, 2015
app pub date -
Oct 21, 2013
filing date -
Jul 17, 2013
priority date (Note) -
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Abstract
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
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