Circuit substrate and method of forming circuit pattern
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United States of America Patent
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Jul 5, 2016
Grant Date -
Dec 4, 2014
app pub date -
Nov 6, 2012
filing date -
Dec 9, 2011
priority date (Note) -
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Abstract
With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.
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