Engineered wood flooring with a double-frame substrate
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United States of America Patent
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Jul 5, 2016
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N/A
app pub date -
Jul 30, 2015
filing date -
Jun 25, 2015
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Abstract
The present invention relates to engineered wood flooring with a double-frame substrate. The engineered wood flooring comprises a double-frame substrate of wood and a solid wood panel adhered to the double-frame substrate. The double-frame substrate of wood comprises a horizontal grain core and two vertical grain frames; two vertical grain frames are bonded on both sides of the horizontal grain core along the grain direction of the core; the horizontal grain core is sandwiched in the middle, and the horizontal grain core and the vertical grain frame are perpendicular to each other and located in the same plane; the vertical grain frame on each side comprises two vertical grain boards, and one vertical wood board is located between the horizontal grain core and the other vertical wood board. The engineered wood flooring has excellent resistance of deformation, small deformation, high strength and steady usage.
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