Process for particleboard manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 5, 2016
Grant Date -
Aug 6, 2015
app pub date -
Feb 9, 2015
filing date -
Oct 13, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Improved particleboard and methods for fabricating improved particleboard (e.g., natural fiber/material-based particleboard) are disclosed. More particularly, the present disclosure provides systems/methods for fabricating particleboard (e.g., formaldehyde-free particleboard) utilizing natural fibers/materials (e.g., lignocellulosic materials), wherein the particleboard has improved performance characteristics and/or mechanical properties. Methods for fabricating fiber-reinforced biocomposites (e.g., natural fiber-reinforced wheat gluten biocomposites) are disclosed. For example, systems/methods for fabricating particleboard from lignocellulosic materials (e.g., coconut materials), along with a binder material (e.g., wheat gluten), are provided. In general, the fiber or lignocellulosic material is treated with sodium hydroxide and/or a silane coupling agent as an adhesion promoter to enhance interfacial adhesion between the fiber and the binder. For example, (3-triethoxysilylpropyl)-t-butylcarbamate (MISO) (a masked isocyanate functional silane) was utilized to improve interfacial adhesion between the binder and the natural fibers.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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UNIVERSITY OF CONNECTICUT | 263 FARMINGTON AVENUE FARMINGTON CT 06030 |
International Classification(s)
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B29D:PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FRO....
- B29B:PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE ....
- B27N:MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR ....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS

Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Asandei, Alexandru | Vernon, US | 3 | 2 |
# of filed Patents : 3 Total Citations : 2 | |||
Dowding, Timothy | Stamford, US | 2 | 2 |
# of filed Patents : 2 Total Citations : 2 | |||
Hemsri, Sudsiri | Bangkok, TH | 2 | 2 |
# of filed Patents : 2 Total Citations : 2 | |||
Parnas, Richard | Ashford, US | 7 | 9 |
# of filed Patents : 7 Total Citations : 9 |
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Patent Citation Ranking
- 0 Citation Count
- B05D Class
- 0 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 5, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Nov 15, 2012 | P | Published | |
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Oct 14, 2011 | F | Filing | |
May 13, 2011 | PD | Priority Date |

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