Pattern forming method

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United States of America Patent

PATENT NO 9381540
APP PUB NO 20150224536A1
SERIAL NO

14697080

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Abstract

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A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 108-0023

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koshiba, Takeshi Yokohama, JP 29 317
Nakasugi, Tetsuro Yokohama, JP 67 622
Yoneda, Ikuo Yokohama, JP 55 576

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