Electrical system and core module thereof
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United States of America Patent
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Jun 28, 2016
Grant Date -
Oct 23, 2014
app pub date -
Jan 23, 2014
filing date -
Apr 23, 2013
priority date (Note) -
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Abstract
Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
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