Pressure application apparatus and pressure application method

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United States of America Patent

PATENT NO 9379082
APP PUB NO 20160084638A1
SERIAL NO

14923676

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Abstract

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A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ΔD between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ΔD is corrected (step S17).

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Patent Owner(s)

Patent OwnerAddress
BONDTECH CO LTDKYOTO CITY KYOTO PREFECTURE JAPAN KYOTO-SHI KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamauchi, Akira Kyoto, JP 155 1542

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