Methods for removing nuclei formed during epitaxial growth

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United States of America Patent

PATENT NO 9378950
SERIAL NO

15051362

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Abstract

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A method for removing nuclei formed during a selective epitaxial growth process includes epitaxially growing a first group of one or more semiconductor structures over a substrate with one or more mask layers. A second group of a plurality of semiconductor structures is formed on the one or more mask layers. The method also includes forming one or more protective layers over the first group of one or more semiconductor structures. At least a subset of the second group of the plurality of semiconductor structures is exposed from the one or more protective layers. The method further includes, subsequent to forming the one or more protective layers over the first group of one or more semiconductor structures, etching at least the subset of the second group of the plurality of semiconductor structures.

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Patent Owner(s)

Patent OwnerAddress
STRATIO INC2211 FORTUNE DRIVE SUITE A SAN JOSE CA 95131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Woo-Shik San Jose, US 8 61
Kim, Youngsik Palo Alto, US 93 320
Lee, Jae Hyung Palo Alto, US 76 333
Na, Yeul East Palo Alto, US 12 20

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