Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
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United States of America Patent
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Jun 21, 2016
Grant Date -
Mar 12, 2015
app pub date -
Sep 5, 2014
filing date -
Sep 9, 2013
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Abstract
A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
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