Wave soldering nozzle system and method of wave soldering
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United States of America Patent
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Jun 21, 2016
Grant Date -
Feb 25, 2016
app pub date -
Aug 21, 2014
filing date -
Aug 21, 2014
priority date (Note) -
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Abstract
A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate.
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