Component mounting substrate and method of managing component mounting substrate
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United States of America
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Jun 14, 2016
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app pub date -
Dec 6, 2013
filing date -
Dec 6, 2013
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Withdrawn
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Abstract
Provided is a method of managing a component mounting substrate that can be used in a roll-to-roll process, without breaking or deteriorating electronic components mounted thereon. In the method of winding, around a core, a flexible component mounting substrate on which a plurality of electronic components are mounted and managing the component mounting substrate as a roll, the roll is held such that the core of the roll is parallel to a vertical direction.
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