Mechanical debonding method and system
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United States of America Patent
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Jun 14, 2016
Grant Date -
Dec 4, 2014
app pub date -
Apr 15, 2014
filing date -
May 29, 2013
priority date (Note) -
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Abstract
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, includes: obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer.
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