Compact electronic package with MEMS IC and related methods
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United States of America Patent
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Jun 14, 2016
Grant Date -
Jul 2, 2015
app pub date -
Dec 31, 2014
filing date -
Jan 2, 2014
priority date (Note) -
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Abstract
An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first IC in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other IC over the first IC and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first IC, and the first other IC.
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