Thermally conductive sheet and process for producing same
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United States of America Patent
Stats
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Jun 14, 2016
Grant Date -
Nov 27, 2014
app pub date -
Jul 3, 2014
filing date -
Jun 17, 2010
priority date (Note) -
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Abstract
A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
DEXERIALS CORPORATION | SHIMOTSUKE-SHI TOCHIGI 323-0194 |
International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- B26D:CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- B06B:GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS I....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29D:PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FRO....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Aramaki, Keisuke | Tochigi, JP | 47 | 231 |
Usui, Hiroyuki | Tochigi, JP | 53 | 276 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 14, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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