Modular spatially combined EHF power amplifier

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9362609
APP PUB NO 20150280650A1
SERIAL NO

14230807

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Abstract

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A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.

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Patent Owner(s)

Patent OwnerAddress
RAYTHEON COMPANY141 SPRING STREET LEXINGTON MA 02173

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Andrew K Alta Loma, US 14 261
Brown, Kenneth W Yucaipa, US 90 1900
Feenstra, Travis B Calimesa, US 9 34
Gritters, Darin M Yucaipa, US 8 47
Sotelo, Michael J Chino, US 8 59

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