Mirco-electro-mechanical system module and manufacturing method thereof
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United States of America Patent
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Jun 7, 2016
Grant Date -
Sep 17, 2015
app pub date -
Mar 10, 2015
filing date -
Mar 11, 2014
priority date (Note) -
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Abstract
The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
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