Wire tail connector for a semiconductor device
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United States of America Patent
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Jun 7, 2016
Grant Date -
Jan 1, 2015
app pub date -
Oct 22, 2012
filing date -
Oct 22, 2012
priority date (Note) -
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Abstract
A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
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