Methods to form conductive thin film structures

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United States of America Patent

PATENT NO 9362230
SERIAL NO

14722302

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Electrically conductive structures and methods of making electrically conductive structures. The methods include providing a dielectric layer of a material having a top surface and a dielectric constant of less than 3; rastering a gas cluster ion beam to form a patterned modified surface region of the top surface of the dielectric layer; and selectively forming an electrically conductive thin film on the patterned modified surface region using atomic layer deposition.

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GLOBALFOUNDRIES INCPO BOX 309 UGLAND HOUSE GRAND CAYMAN KY1-1104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clevenger, Lawrence A LaGrangeville, US 787 5051
McGahay, Vincent J Poughkeepsie, US 73 986
Nag, Joyeeta Wappingers Falls, US 27 182
Xu, Yiheng Hopewell Junction, US 56 379

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