Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 7, 2016
Grant Date -
Jul 10, 2014
app pub date -
Mar 12, 2014
filing date -
Sep 13, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing a lead frame structure for semiconductor packaging. The method includes providing a metal substrate having a top surface and a back surface, forming a first photoresist film on the top surface of the metal substrate, forming a top surface etching pattern in the first photoresist film using photolithography, forming a second photoresist film on the back surface of the metal substrate, forming a back surface etching pattern in the second photoresist film using photolithography, performing an etching process on the top surface and the back surface of the metal substrate, removing the first photoresist film and the second photoresist film, placing the etched metal substrate in a mold, encapsulating the etched metal substrate using the mold; and performing a plating process on the encapsulated metal substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully