Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit

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United States of America

PATENT NO 9362193
SERIAL NO

13742456

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Abstract

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A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hable, Wolfram Neumarkt, DE 21 124
Hoeglauer, Josef Heimstetten, DE 95 732
Hosseini, Khalil Weihmichl, DE 90 609
Mahler, Joachim Regensburg, DE 224 2135
Mengel, Manfred Bad Abbach, DE 68 753
Otremba, Ralf Kaufbeuren, DE 285 3326
Schloegel, Xaver Sachsenkam, DE 68 618
Schredl, Juergen Mering, DE 26 193

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