Surface treating apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9359676
APP PUB NO 20140116334A1
SERIAL NO

14038340

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Abstract

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An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

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Patent Owner(s)

Patent OwnerAddress
C UYEMURA & CO LTD2-6 DOSHO-MACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0045

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asa, Fujio Osaka, JP 2 12
Hoshi, Syunsaku Osaka, JP 2 9
Hotta, Teruyuki Osaka, JP 41 546
Ishizaki, Takahiro Osaka, JP 19 65
Mizumoto, Junji Osaka, JP 4 17
Okamachi, Takuya Osaka, JP 5 23
Utsumi, Masayuki Osaka, JP 21 181
Yamamoto, Hisamitsu Osaka, JP 26 61

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