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Country	kind	publication No.	Filing Date	Type	Sub-Type
US	A1	US20110266077	Apr 29, 2010	Patent	Application
Type : Patent Sub-Type : Application
FIRST PUBLISHED PATENT APPLICATION		Autonomous propulsion system		Nov 03, 2011

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NADEAU CLAUDE	Not Provided

International Classification(s)

• B62M:RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; P....
• B62D:MOTOR VEHICLES; TRAILERS
• A63C:SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF C....

• 2014 Application Filing Year
• B62M Class
• 329 Applications Filed
• 279 Patents Issued To-Date
• 84.81 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nadeau, Claude	Montreal, CA	3	18
# of filed Patents : 3 Total Citations : 18

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Patent Citation Ranking

• 4 Citation Count
• B62M Class

• 15.03 % this patent is cited more than
• 9 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 7, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 07, 2016	US,9358999,B2   US9358999B2	GRANTED PATENT AS SECOND PUBLICATION
March 12, 2015	US,20150068351,A1   US20150068351A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8059424

Electronic board incorporating a heating resistor

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Abstract

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An electronic board including an area forming a BGA type electronic component backing, and an electric heating resistor which supplies an amount of heat for soldering the component onto the plate is disclosed. The board includes a plurality of conductive layers alternating with electrically insulating layers, the resistor forming one of the conductive layers immediately underlying the surface layer. The board may also include a thermal drain. A facility for implementing the method is also disclosed. It allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

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Description

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Claims

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Claims data not available

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Legal Events

 

• STCH2013
• FP2013
• LAPS2013
• REMI2013
• I2009
• F2006
• AS2006
• PD2004

Date	Code	Event	Description
Jul 22, 2013	STCH	INFORMATION ON STATUS: PATENT DISCONTINUATION	free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362
Jun 23, 2013	FP	LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE	Effective Date: Jun 23, 2013
Jun 23, 2013	LAPS	LAPSE FOR FAILURE TO PAY MAINTENANCE FEES
Feb 04, 2013	REMI	MAINTENANCE FEE REMINDER MAILED
Jun 23, 2009	I	Issuance
Nov 21, 2006	F	Filing
Mar 05, 2006	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:STACKHOUSE, JAMES B.;WILLIAMSON, STUART B.;REEL/FRAME:022674/0548 Owner name: FIBERZONE, INC., TENNESSEE Effective Date: Mar 05, 2006
Sep 26, 2004	PD	Priority Date