Circuit board having a plated through hole through a conductive pad
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United States of America Patent
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May 31, 2016
Grant Date -
Jun 18, 2015
app pub date -
Feb 27, 2015
filing date -
Mar 18, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
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