Optical semiconductor lighting apparatus
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United States of America Patent
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May 31, 2016
Grant Date -
Nov 19, 2015
app pub date -
May 22, 2015
filing date -
Apr 16, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.
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