Light emitting device package
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United States of America Patent
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May 31, 2016
Grant Date -
Jan 1, 2015
app pub date -
Mar 14, 2014
filing date -
Jun 27, 2013
priority date (Note) -
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Abstract
Disclosed is a light emitting device package including a package body having at least one cavity, at least one light emitting device mounted on the cavity, and a molding member disposed on the light emitting device to fill the cavity. The package body has at least one first recess formed at an upper portion than a bottom surface of the cavity, and the molding member is disposed to an inner edge of the at least one first recess.
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