Compact light sensing modules including reflective surfaces to enhance light collection and/or emission, and methods of fabricating such modules
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United States of America Patent
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May 31, 2016
Grant Date -
Dec 24, 2015
app pub date -
Jun 15, 2015
filing date -
Jun 20, 2014
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Abstract
The disclosure describes light sensing optoelectronic modules that include reflective surfaces to enhance light collection and/or light emission. For example, an optoelectronic module can include a light sensing element mounted on a substrate. A spacer over the substrate has a through-hole over the light sensing element. The through-hole is defined by a surface that is at least partially sloped or curved with respect to a plane of the substrate. The surface is highly reflective for light detectable by the light sensing element. Various methods for fabricating the modules are described as well.
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