Methods and systems for inspecting bonded wafers

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United States of America Patent

PATENT NO 9355919
APP PUB NO 20130157391A1
SERIAL NO

13818967

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Abstract

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A method of inspecting a bonded wafer 3 arrangement comprises:

    directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture δ of the imaging 16, 18 is less than 0.05; andsimultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view;wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.

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Patent Owner(s)

Patent OwnerAddress
NANDA TECHNOLOGIES GMBHUNTERSCHLEISSHEIM

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Estermann, Markus Babensham, DE 4 35
Kappel, Christoph Aschheim, DE 4 2
Kharrazian, Reza Stephanskirchen, DE 2 2
Markwort, Lars Haimhausen, DE 17 336

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