Wafer support device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 9355885
SERIAL NO

13593479

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Abstract

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A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Tien-Chih Zhubei, TW 7 9
Kao, Chen-Chiao New Taipei, TW 2 1
Suen, Shu-Huei Zhudong Township, Hsinchu County, TW 24 37
Zhang, Ying Hsinchu, TW 923 12176

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