Method for increasing adhesion of copper to polymeric surfaces
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United States of America Patent
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May 31, 2016
Grant Date -
Feb 12, 2015
app pub date -
Jun 18, 2014
filing date -
Aug 6, 2013
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Abstract
Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.
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