Resin mold for imprinting and method for producing the same
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United States of America Patent
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May 31, 2016
Grant Date -
May 31, 2012
app pub date -
Aug 6, 2010
filing date -
Aug 7, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.
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