Composition for removing and preventing formation of oxide on the surface of metal wire
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United States of America Patent
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May 31, 2016
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Oct 22, 2015
app pub date -
Jul 24, 2013
filing date -
Jul 24, 2012
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Abstract
The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.
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