Stud bump bonding in implantable medical devices

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United States of America Patent

PATENT NO 9351436
APP PUB NO 20140254124A1
SERIAL NO

13790141

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

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Patent Owner(s)

Patent OwnerAddress
COCHLEAR LIMITED1 UNIVERSITY AVENUE MACQUARIE UNIVERSITY NSW 2109

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bennett, Robert St. Peters, AU 603 83089
Ignacio, Gary Mark Woolloomooloo, AU 2 19
Mudie, Andrew Petersham, AU 1 8
Raje, Milind Wentworthville, AU 12 1327

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