Coreless layer buildup structure with LGA and joining layer
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United States of America Patent
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May 24, 2016
Grant Date -
Feb 9, 2012
app pub date -
Apr 22, 2010
filing date -
Apr 22, 2010
priority date (Note) -
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Abstract
A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
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