Interconnect substrate and electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 24, 2016
Grant Date -
Jun 18, 2015
app pub date -
Feb 24, 2015
filing date -
Aug 30, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect substrate comprising a laminated body, including an electric conductor and an insulator, over which an electronic element is disposed, wherein the laminated body includes a first layer having at least one first conductor separated in an island shape, a first connecting member which is buried in the laminated body in order to electrically connect the electronic element and the first conductor, a second layer having a third conductor which is provided opposite to at least a partial region of the first conductor, a second conductor which is provided opposite to at least one of the first conductor and the third conductor with a layer of the insulator interposed therebetween, and a second connecting member, buried in the laminated body, which electrically connects the second conductor and the first conductor or the third conductor.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 9 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 24, 2027 |
