Integrated circuit device
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United States of America Patent
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May 24, 2016
Grant Date -
Feb 5, 2015
app pub date -
Jul 28, 2014
filing date -
Aug 5, 2013
priority date (Note) -
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Abstract
An integrated circuit device includes a semiconductor substrate, an active element and a passive element. The active element is made of the semiconductor substrate. The passive element includes a functional element filled in a groove or hole provided in the semiconductor substrate along a thickness direction thereof and is electrically connected to the active element. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound.
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