Sensor device and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
May 24, 2016
Issued Date -
N/A
app pub date -
May 18, 2012
filing date -
May 18, 2012
priority date (Note) -
Withdrawn
status (Latency Note)
Importance
Abstract
A sensor device and a manufacturing method thereof are provided in which no resin seal is used when a sensor is packaged, a change in connection relation according to a change in specifications of the control IC and others is facilitated when a control IC is packaged together with the sensor and high reliability is kept. The sensor device of the present invention includes a substrate containing an organic material and being formed a wiring, a sensor arranged on the substrate and electrically connected to the wiring, and a package cap arranged on the substrate and containing an organic material and covering the sensor, and the inside of the package cap is hollow.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully