Heat dissipating device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 24, 2016
Grant Date -
May 15, 2014
app pub date -
Nov 4, 2013
filing date -
Nov 14, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully