Reduced pressure drying method and device of a substrate
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United States of America Patent
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May 24, 2016
Grant Date -
Oct 22, 2015
app pub date -
May 23, 2013
filing date -
Mar 28, 2013
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Abstract
A reduced pressure drying method and device for a substrate are presented. Firstly, a substrate is placed in a sealed space; then the surface to-be-dried of the substrate is partitioned into a predetermined number of sealed regions; thereafter, the sealed regions are subjected to pressure reduction through gas extraction; finally, the sealed regions are dried through gas insufflation, and then the substrate is taken out from the sealed space. The method can perform reduced pressure drying to various-sized substrates, ensuring uniform pressure and humidity and avoiding formation of reduced pressure drying speckles.
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