Low ambient cooling kit for variable refrigerant flow heat pump

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United States of America Patent

PATENT NO 9347700
APP PUB NO 20140260363A1
SERIAL NO

14294381

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Systems and methods for low ambient air temperature cooling in air-source based heat pump systems wherein an outdoor heat pump unit includes a discharge hood positionable over its fan. The hood including a damper that is openable and closeable as a function of outside temperature. The outdoor unit may also include wind deflectors positioned over the coil openings of the disclosure. During cooling operations below a low outside air threshold temperature, e.g., below 23° F., the damper assembly partially closes to reduce airflow across the condenser coil of the outdoor unit to a level below that which is possible at minimum fan speed. As the outdoor temperature continues to drop, the damper assembly continues to close to further reduce airflow.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008310 ?1008310

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bush, Joseph P Lawrenceville, US 5 40

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