Composite member including substrate made of composite material
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United States of America Patent
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May 24, 2016
Grant Date -
Dec 12, 2013
app pub date -
Feb 20, 2012
filing date -
Mar 22, 2011
priority date (Note) -
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Abstract
A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10−3 and not more than 10×10−3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
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