Thermally conductive dielectric for thermoformable circuits
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United States of America Patent
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May 24, 2016
Grant Date -
Feb 5, 2015
app pub date -
Jul 14, 2014
filing date -
Jul 31, 2013
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Abstract
This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.
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