Substrate having laser sintered underplate

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United States of America Patent

PATENT NO 9346114
SERIAL NO

12913839

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Abstract

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A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate.

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Patent Owner(s)

Patent OwnerAddress
AEROJET ROCKETDYNE OF DE INCP O BOX 13222 SACRAMENTO CA 95813-6000

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hertel, Thomas A Canoga Park, US 11 33

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