Substrate structure and the process manufacturing the same
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United States of America Patent
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May 17, 2016
Grant Date -
Aug 7, 2014
app pub date -
Feb 7, 2013
filing date -
Feb 7, 2013
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Abstract
The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.
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